Recent content by Joe NYC

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Question Zen 6 Speculation Thread

It's not like they would be wasting a lot of space between the area of the wafer and area of the sum of the tiles. What will, then, change the direction of MS movement, which is still in favor of Arm? Arm substantially increasing the licensing fees could be one variable. But before that...
- Joe NYC
- Post #3,881
- Thursday at 10:57 PM
- Forum: CPUs and Overclocking
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Question Zen 6 Speculation Thread

I think it was just an existing design in search of customer, and AMD just calls it "semicustom" when a customer finally signed up.
- Joe NYC
- Post #3,877
- Thursday at 9:56 PM
- Forum: CPUs and Overclocking
J
Question Zen 6 Speculation Thread

Combined size of the chipet AMD is dealing with is not overwhelmingly large, within 400 mm2, so still a good number can fit on 300mm wafer. Bergamo is only the first attempt. Turin Dense and Venice Dense should be able to compete better. But I will convinced only when the hyperscalers...
- Joe NYC
- Post #3,876
- Thursday at 9:55 PM
- Forum: CPUs and Overclocking
J
Question Zen 6 Speculation Thread

N32 sold for $400 - $500. That's as mainstream as you get, while N33 is low end. Just because N32 sold far less than it's potential (if it was a very good generation) does not prove this point. AMD intended to sell a lot more N31, N32, and capacity for that was there back in 2022. When will...
- Joe NYC
- Post #3,871
- Thursday at 8:04 PM
- Forum: CPUs and Overclocking
J
Question Zen 6 Speculation Thread

AMD has been pioneering in this area, and, until now, did not have a very effective and affordable 2.5D solution. Now, AMD has it in InFO, and is expanding its use. Is it illogical to expect that AMD will expand it further? To stop Arm encroachment into datacenter, to change value...
- Joe NYC
- Post #3,870
- Thursday at 7:56 PM
- Forum: CPUs and Overclocking
J
Question Zen 6 Speculation Thread

AMD already tried with RDNA 3, with expectation of much bigger volume that was achieved. So the capacity was there back in 2022. The actual volume shipped was depressed because of bad cycle in GPU sales and RDNA 3 underwhelming performance. The can substitute cheap node for expensive node...
- Joe NYC
- Post #3,866
- Thursday at 7:11 PM
- Forum: CPUs and Overclocking
J
Question Zen 6 Speculation Thread

The question is if (and to what effect) semi-custom evolves in the age of chiplets. Really, it has been pretty much NADA from AMD on semicustom front. Many people expected semicustom designs for, perhaps, hyperscalers in datacenter from AMD and AMD delivered exactly zero on this front so far...
- Joe NYC
- Post #3,864
- Thursday at 6:57 PM
- Forum: CPUs and Overclocking
J
Question Zen 6 Speculation Thread

Companies other than TSMC (such as ASE) can do the this type of packaging (Integrated Fan Out) just fine. I am not buying that this will forever be capacity constrained. Yield is one issue, cost of advanced nodes (where advanced nodes may not be necessary) is another issue. I am pretty sure...
- Joe NYC
- Post #3,862
- Thursday at 6:51 PM
- Forum: CPUs and Overclocking
J
Question Zen 6 Speculation Thread

BTW, here is Olrak's post that he calls schizopost. Year and a half later, it does not look insane...
- Joe NYC
- Post #3,859
- Thursday at 5:09 PM
- Forum: CPUs and Overclocking
J
Question Zen 6 Speculation Thread

The discussion was about next gen consoles, which are much bigger die sizes that APUs. Which is why I think it is possible they may go chiplet route...
- Joe NYC
- Post #3,857
- Thursday at 4:38 PM
- Forum: CPUs and Overclocking
J
Question Zen 6 Speculation Thread

AMD has used monolithic for mobile, to keep the costs down, but is already expected to go with chiplets with high end mobile. So there is a resistance posed by big die sizes (yields) especially on more costly process, and increased complexity of validating a huge die. We will see what emerges...
- Joe NYC
- Post #3,855
- Thursday at 4:10 PM
- Forum: CPUs and Overclocking
J
Question Zen 6 Speculation Thread

It seems that Intel has mostly the wrong type of packaging for mass market.
- Joe NYC
- Post #3,854
- Thursday at 2:37 PM
- Forum: CPUs and Overclocking
J
Question Zen 6 Speculation Thread

I think there is a misconception that the fabless companies are constantly in a trade-off situation where they misjudged demand for multiple products and have to constantly shuffle capacity between them. I think it is much simple than that. Company, like AMD, places and order for a product...
- Joe NYC
- Post #3,817
- Wednesday at 5:09 PM
- Forum: CPUs and Overclocking
J
Question Zen 6 Speculation Thread

32 GB or more of GDDR7 is also $$$. BTW, AMD used chiplets in RDNA3, with MALL cache on them, to improve the effective bandwidth. Even though GDDR already has good bandwidth. Why not use that approach with LPDDR5, with mall, on trailing node. this would be the best of both worlds: big memory...
- Joe NYC
- Post #3,815
- Wednesday at 4:50 PM
- Forum: CPUs and Overclocking
J
Question Zen 6 Speculation Thread

XBOX console, XBOX handheld, PS6 console, PS handheld. That's a lot of bespoke designs there. I think there is a good possibility there will be some sharing of designs to silicon or even chiplets. If AMD has designed standardized chiplet to chiplet connectivity, why not use it, rather than...
- Joe NYC
- Post #3,811
- Wednesday at 4:35 PM
- Forum: CPUs and Overclocking

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