F CPus were desperately included just to take every little bit of working silicon to market as possible. At least at first.
There is no doubt that Intel will find a way to build a premium markup on the "normal" skus in the future as their iGPs start to become actually decent. The F cpus is the...
Intel's playbook didn't include tick+tock in the same year tho.
Only thing AMD is not being fast enough is on mobile. Zen 2 mobile APUs need to be the start of the CES 2020 showcase because if it's exactly 12 months after Zen 2 desktop, a lot of the momentum will be lost to Intel's new mobile...
When ATI was smashing Nvidia at every metric when HD 5xxx just came around and Nvidia was still on GTX/S 2XX, the marketshare at most stayed 50-50. THAT is the effect of mindshare working at it's fullest.
Now getting back to the matter and say 200cm2 sized plate, wich is not as much as what Gygabyte used, and check how much it can dissipate at an ambiant of 300°K (27°C).
The plate has two sides], so its total radiative surface is 400cm2
Strike one. You calculation starts wrong assuming air...
That 200cm2 that you pulled out of your ass? Sorry, I have enough debunking the other garbage you spewed in this thread already. The area claim by me is to debunk that the heatsink I used for my nuc is bigger in area than the one you linked in the J5005-ITX. Not only it's false, but by per the...
A "hot" video card that is not a blower design and has the fin stack perpendicular to the motherboard will actually help moving air through. Hot moving air is still better than stagnant but still above ambient air.
The problem is, when you design something you have to think of all the use cases...
The shape impacts the heat transfer behaviour heavily, there is a reason they chose a tall radial fin shape for that heatsink. On height restricted heatsinks even if you match surface area like that heatsink you wont be able to match it's thermal performance because heat wont spread the same way...
But i never talked about that product lmao. Also that heatsink is pretty bigger than the one I'm using, and the one I'm using is one of the bigger Z97 chipset ones. You are totally making a non-point here.
Besides that, by height that heatsink you show is at least 3 centimeters tall, how do you...
You are quite wrong, the stock heatsink for this J5005 is this one on the right and is an active heatsink design that is made with the closed enclosure of the nuc in mind and keeps said nuc in the 70-80c at load.
Have in mind the difference of design between both, the one of the left (which is...
Since vrm heatsink design is one of my strange areas of interest here is a proper vrm heatsink design, the Hr-09u made by thermalright.
The baseplate is nickeled copper, the heatpipe is flat and touches the base to actually transfer the heat closes to the heat source unlike the p5q-e one, the...
This is a p5q-e heatsink shared between the left set of vrms and the chipset. The p45 chipset per my caliper measures 11.5x9.5mm.
The heatsink seems stronger that it really is. The deceiving color makes you think we are talking about 100% copper but in reality is anodized aluminum made to look...
It is not
This looks like a flat object with no heat dissipation properties at all to you?
Your argument would look better if it didnt require to "flat" deny thermophysics for it to work.
Just to be clear, Intel states 4.1w tdp for the Z97 chipset. Even with the red gigabyte logo cover...
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