Well, Intel is a large TSMC customer today, and the DG2 graphics stuff is on TSMC 6nm as far as I know.
Nobody can predict the future, but a very plausible scenario is that Intel starts to make tiles at TSMC, and combine them with some tiles they produce themselves. Sort of like AMD using TSMC...
I think it is almost certain Intel will use TSMC 3nm also. There is then the question about capacity, and of course also that Intel's own manufacturing may be dead for the bleeding edge when they start to rely on TSMC for the most critical tiles.
But can't that be turned around? Surely it must be possible for Intel to build some great CPU architecture/design teams if they do not already have that at the moment. Or is the mismanagement that deep?
They could always turn to TSMC, and in that way return to the leading edge. Not as a wafer manufacturer, but as a CPU supplier, with packaging and some tiles done in-house. Isn't that the way the wind is blowing, with the talk of Intel doing some stuff on TSMC 3nm?
Also, it is no natural law...
This sounds like Intel may have some bumpy years ahead still. Maybe Alder Lake will be great, but their best chance for a reset almost seems to be at the point with 3 nm tiles from TSMC.
Gelsinger has talked about hiring more engineers. Do you think he is fixing the problems, or is it so bad that it will take a long time to right the ship?
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