https://wccftech.com/next-gen-hbm-a...gb-capacity-per-24-hi-stack-embedded-cooling/
Looking at the details for HBM4, the memory aims to offer a data rate of 8 Gbps with a 2048-bit IO, 2.0 TB/s of memory bandwidth per stack, 24 Gb capacity per die for up to 36-48 GB memory capacity, and a per-stack power package of 75W. HBM4 goes with the standard direct-to-chip (D2C) Liquid cooling and employs a custom HBM-based die (HBM-LPDDR).
Interestingly, AMD's Instinct MI400, which launches next year too, takes things up a notch versus Rubin and is aiming to offer 432 GB of HBM4 capacity with memory bandwidth of up to 19.6 TB/s.
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