A joint development with IBM. Rumor has it, AMD can tweak 40% more from their current cores. Well, even as a AMD fanboi I can't believe AMD can pull 40% out of it.
Umm, 40% is GOOD, but not GOOD if you know what they are talking about. They are comparing SOI, DSL against BULK silicon. Now that's good. Except they are using both SOI and DSL. Not so good anymore. Sure they can get few % but not 40%. A simple 40% created so much rumors and assumptions. If you scale it, its around as bad as the Conroe news creating all the assumptions/rumors.
Fanboy?? Or not?? Let's analyze, see the following
1. "Intel's 90nm sucks because it leaks since it runs so hot as shown by Prescott, while AMD's will be better because its better on the current CPUs"
Sort of Fanboy, maybe just ignorant or lazy. I assume this person also thinks that Dothan is using a AMD's process because it consumes little power?? Simple look at the architecture of Prescott shows why it runs so hot.
125 million transistors(!!). Let's calculate this. Northwood=55 million, 512KB L2, Willamette=42 million, 256KB L2. A theoretical Northwood 1M would be=81 million.
125 million(Prescott)-81 million(Theoretical Northwood 1M)=44 million
Remember also cache consumes very little power. Where did the 44 million go?? All power hungry part of the CPU. No wonder it runs so hot.
Die size of Prescott=112mm2, Die size of Northwood=131mm2
Prescott TDP=103W, Northwood TDP=82W
Thermal density increased by 46.9%!!! Of course we can't see that as linear increase in heat, but it will contribute significantly nonetheless.
2. Assuming that Core would run hotter than TDP because it does in Prescott
Ignorance and Uninformed
I have heard in forums where it was said that Dothan consumes lower power than TDP. However opposite is true for Prescott. It consumes more than TDP.
I assume Core Duo would be same. It would also be true for Core arch. Because Prescott's thermal management SUCKS. EIST, TM2, they are more advanced on PM/Core Duo than Prescott cores.