ICD7 requires NO cure or break-in time. Temps you get right away are the temps you get months from now. It is thicker and the creater recommends a high pressure mount of the HSF. Heavier heatsinks, when mounted and placed on it's side (like most upright cases) will tend to have uneven mounting pressure due to weight and gravity. A bolt-through mount is preferred.
Here's a user review I did on it. Bottom line, I did see an improvement over ASC
Artic Silver Ceramique vs.
IC Diamond 7 Carat
I?m not one that received the free thermal compound from IC, but a quick google search while I was bored at work brought up the ocforums.com. It piqued my interest because I ran out of my favorite thermal interface material, Arctic Silver Ceramique (which coincidently, I received free in the past).
I liked Artic Silver Ceramique because of its non-conductive, easy to work with material. It also provided a faster curing time than its more famous brother, Arctic Silver 5. Not to mention, it?s usually a bit cheaper than AS5 and can be found at hundreds of vendors. While that's all good, it also showed a slight improvement by an avg of 1C over AS5.
I decided to go with a new TIM for my personal gaming PC (Q6600 B3 @ 3.2GHz). The IC Diamond 7 (IC7) is fairly new, and I could only find it at 3 vendors (Directron.com Petrastechshop.com & Heatsinkfactory.com)
What drew me to IC7 were 2 things, diamonds and thicker bond material. Diamond thermal conductivity rates up better than silver. That?s a very good thing when our goal is transfer heat effectively from the CPU to heatsink. The other is the thickness of bond material. IC7?s site provided a view that thinner grease is susceptible to grease pump out. Mainly, as the material heats up, it expands, and eventually, this action pumps it out to the edges of the heatsink. Due to this pumping action by thermal cycling, the amount of TIM between the CPU and HSF becomes a problem of enough TIM to effectively transfer heat and months later, have to be re-applied.
So, with my head filled with IC?s sales pitch, I pulled out my trusty credit card and plucked down $7.50 ($6 + $1.50sh USPS 1st Class) for this diamond TIM. Two days later, I find it in my mailbox. It was the first time I ordered anything from Petrastechshop.com and they shipped out my order the same day.
Opening the small envelope, I find the IC7 TIM inside. It?s not in any packaging, no fancy blister pack, no plastic sleeve, nothing. That?s fine, anything to cut costs. It arrived safely.
http://img.photobucket.com/alb...r/TIM_Shootout/ic7.jpg
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Arctic Silver Ceramique:
First up is Arctic Silver Ceramique. I applied this to my HSF/CPU about a month ago (when I upgraded to a TR Bolt-Thru kit for my HSF) so it?s had plenty of time to cure.
It comes in a non-see thru plunger applicator. Apply Ceramique is very easy to deal with. It reminds me of the generic silicon TIM you see everywhere.
IC Diamond 7 Carat:
This comes in a rather large plunger applicator. My first impression was ?Wow! That?s a lot!?. Then I decided to peel off the label. Yeah, them my reaction was, ?Hrm. That doesn?t seem like a whole lot?.
http://img.photobucket.com/alb.../TIM_Shootout/ic7a.jpg
http://img.photobucket.com/alb.../TIM_Shootout/ic7b.jpg
http://img.photobucket.com/alb.../TIM_Shootout/ic7c.jpg
Reading about how thick this was on the Internet, I was wondering how my experience was going to go. Surprisingly, it wasn?t as thick or as hard to apply as I thought it would be. It was a bit thicker than Ceramique, and did require a little bit more ?oomph? to push down the plunger, but if I didn?t have that to compare it to, then I really wouldn?t have even thought about it. (I actually had a more trouble dealing with Cooler Master TIM)
TEST BENCH:
Intel Q6600 (B3) @ 2.4GHz, 3.0GHz, 3.2GHz)
Kingwin RVT-12025 Heatsink w/ 120mm fan (max rpm)
*Note: Using a Thermalright 775 Bolt-Thru Mounting Kit
eVGA 650i motherboard
eVGA 8800GT 512MB Video
Antec 900 case (closed)
AMBIENT ROOM TEMP: 21C
AMBIENT CASE TEMP: 24C
A note about the setup. The
Kingwin RVT-12025 (also known as a rebadged
Xigmatek HDT-1283) is a unique HSF. It incorporates what?s called a ?Heat-pipe Direct Touch? system. Basically, it uses the 3x 8mm heatpipes to come in direct contact with the CPU to transfer the heat rather than the heatpipes buried into a solid copper or aluminum base. This makes applying any TIM a bit different than what manufacturers recommend.
I used the same process for both TIMs tested here. Artic Silver recommends a single line between the cores on the CPU and a thin layer rubbed on the HSF. IC7 recommends a ?pea-sized? glob on top of the CPU. I felt that neither of these methods work with a HDT design. What I did was apply a thin line on each of the heatpipes.
After applying three lines to the HSF, I found I used up about 1/3 of the available material.
http://img.photobucket.com/alb.../TIM_Shootout/ic7d.jpg
http://img.photobucket.com/alb.../TIM_Shootout/ic7e.jpg
TESTING
CASE FAN CONFIGURATION:
I?m just a simple end-user. There?s no special set-up, it?s what I use 24/7 as my gaming platform. My system is buttoned up in an Antec 900 case and kept with case covers on. Max RPM was set on the HSF fan for both TIMs.
http://img.photobucket.com/alb...temps/antec_flow02.jpg
http://img.photobucket.com/alb.../case_mod/DSCF1198.jpg
RESULTS:
Ambient Room Temperature was kept at a CONSTANT 21.0C. Load tests were conducted with PRIME95, Small FFTs for about 15 minutes each. Tests were conducted at speed/volts: 2.4GHz/AutoV, 3.0GHz/1.312V, 3.2GHz/1.343V
Artic Silver Ceramique:
2.4GHz - Auto Volts
IDLE: / LOAD:
Core1: 36C/ 57C
Core2: 36C/ 57C
Core3: 36C/ 54C
Core4: 36C/ 54C
3.0GHz ? 1.312V
IDLE: / LOAD:
Core1: 37C/ 62C
Core2: 36C/ 59C
Core3: 36C/ 59C
Core4: 37C/ 62C
3.2GHz ? 1.343V
IDLE: / LOAD:
Core1: 37C/ 63C
Core2: 36C/ 64C
Core3: 36C/ 64C
Core4: 37C/ 63C
IC Diamond 7 Carat:
2.4GHz ? Auto Volts
IDLE: / LOAD:
Core1: 35C/ 54C
Core2: 34C/ 51C
Core3: 35C/ 54C
Core4: 35C/ 51C
3.0GHz ? 1.312V
IDLE: / LOAD:
Core1: 36C/ 58C
Core2: 35C/ 55C
Core3: 34C/ 55C
Core4: 36C/ 58C
3.2GHz ? 1.343V
IDLE: / LOAD:
Core1: 36C/ 61C
Core2: 36C/ 58C
Core3: 35C/ 58C
Core4: 36C/ 61C
To my surprise, the IC7 trumped Ceramique. Usually, I was expecting a 1C degree difference in either direction between these 2 TIMS. What I got was a ?4C difference using IC7 over Ceramique at 3.2GHz under load. That?s an impressive improvement between TIMs. At all speeds under Idle/Load, the IC7 wins out.
IDLE: .75C Average Difference (2.4GHz, 3.0GHz, 3.2GHz) IC7 Wins
LOAD: 3.333C Average Difference (2.4GHz, 3.0GHz, 3.2GHz) IC7 Wins
The graph below represents the Average Temperature of all 4 Cores.
http://img.photobucket.com/alb...ootout/tim_results.jpg
I tried my best to simulate a constant environment condition between the two TIMS, from keeping the same ambient temperatures to the way I applied the tims. The bottom line is that I?m using it as any other end-user would use the product. There was no special test bench setup I used, no tweaks, no special measuring equipment (other than a thermometer, Core-Temp, and Prime95).