HELP: Question about thermal compound

[Veloxe76]

Hey guys,
Please help me with this issue. Iam planning to replace the stock HSF of my GF2 TI450 card for a new crystal orb. My question is what kind of thermal compound I should use for the orb, the normal Artic Silver 3 or the AS adhesive.
Thanks a lot in advance

 

[tenoc]

Probably came secured with plastic pins. Remove carefully and use with AS3. Shouldn't need them with adhesive once dry.

Of course, if you plan on taking it off repeatedly, don't glue it.

 

[Jeff7]

I prefer to use AS3 with epoxy, not the AS3 adhesive. Here's the way I figure it:
From what I can tell AS3 adhesive is just AS3 mixed with some epoxy. Problem with this is that it slightly dilutes the AS3, lowering its effectiveness.
What I do is to put some AS3 in the middle, and some regular epoxy on the corners. This holds it on fairly securely, there's less risk of killing the chip should the heatsink need to be removed later, and the AS3 can work undiluted.
Of course, if the heatsink is held on by those plastic latching pin things, then just use plain AS3 without any adhesive.