The fact that only 22 of those 24 cores are activated in the top Xeon E5 SKU is purely a product differentiation decision. The 18 core Xeon E5 v3 used exactly the same die as the Xeon E7, and this has not changed in the new "Broadwell" generation.
The largest die (+/- 454 mm²), highest core (HCC) count SKUs still work with a two ring configuration connected by two bridges. The rings move data in opposite directions (clockwise/counter-clockwise) in order to reduce latency by allowing data to take the shortest path to the destination.
...Just like Haswell-EP, the Broadwell-EP Xeon E5 has three different die configurations. The second configuration supports 12 to 15 cores and is a smaller version (306mm²) of the third die configuration that we described above. These dies still have two memory controllers.
On Haswell, one AVX instruction on one core forced all cores on the same socket to slow down their clockspeed by around 2 to 4 speed bins (-200,-400 MHz) for at least 1 ms, as AVX has a higher power requirement that reduces how much a CPU can turbo. On Broadwell, only the cores that run AVX code will be reducing their clockspeed, allowing the other cores to run at higher speeds.
AnandTech's review is out:
AnandTech - The Intel Xeon E5 v4 Review: Testing Broadwell-EP With Demanding Server Workloads
24-core die size: 454mm²
15-core die size: 306mm²
www.anandtech.com/print/10158/the-intel-xeon-e5-v4-review
Xeon E5 v4 'Broadwell-EP' Processor Family Officially Launched
Three die configurations: 10-core (up to 8 active), 15-core (up to 14 active) and 24-core (up to 22 active)
More here
Supermicro New Generation Servers with Intel Xeon E5 2600 V4 (Broadwell) Product Family Support
SPECjbb2015 Results for Xeon E5-2699 v4
Amazon listing
MSI's X99S XPOWER AC LGA2011-v3 motherboard gets official support after BIOS update
www.nextplatform.com/2016/03/31/broadwell-brings-xeon-e5s-balanced-performance-bump
24-core die size: 454mm²
Is it clear now that Broadwell-E will NOT have L4/eDRAM?
Not to mention those regular senteces ending with".."You can just feel the disdain for Intel's server product superiority ooze from this reviewer.
does skylake-ep launch tomorrow?
24-core die size: 454mm²
15-core die size: 306mm²
One die is smaller than Tahiti or Tonga, the other is no bigger than Hawaii. That demonstrates just how badly we're getting soaked on pricing, due to the lack of competition.
does skylake-ep launch tomorrow?
It never would.
It got a big L3 cache instead. 25MB or the top Broadwell-E.
That's what I gathered. So, it will be nothing spectacular other than the higher core counts available.
That's a nice shrink from Haswell E7's 662 mm² (18 cores).
One die is smaller than Tahiti or Tonga, the other is no bigger than Hawaii. That demonstrates just how badly we're getting soaked on pricing, due to the lack of competition.
Cost/mm^2 here is much higher, your comparison doesn't make a ton of sense. Also can guarantee you that the R&D intensity of developing a high performance server processor is much greater than that of developing a dGPU.
Yes and NAND is even cheaper. OMG Evil Nvidia and AMD!
Just shows how little you know about cost and business. Specially R&D.
The Low Core Count die is 10-cores, so we're pretty likely to get a 10-core i7 Extreme.
We already know we are getting one
They may first be released at Computex it seems.
Not to mention those regular senteces ending with".."
I don't think Intel has many problems. I see from what I can tell a pretty nice set of improvements / new features, more cores, new production process. Intel always said they promise 20% per gen, which they pretty much deliver.
And never mind Skylake that's coming next year..