So what exactly did you conclude after reading that article, in relation to Intel using TIM on HEDT chips?
So what exactly did you conclude after reading that article, in relation to Intel using TIM on HEDT chips?
The wider public overall has no idea what their CPU temperature is and they could not care less.You are making the assumption that the TIM is the issue.
The primary issue is the high temps. Talking about the TIM is to try and understand why this is happening.
Trust me, the wider public will see the higher temps and have reservations.
You are making the assumption that the TIM is the issue.
The primary issue is the high temps. Talking about the TIM is to try and understand why this is happening.
Trust me, the wider public will see the higher temps and have reservations.
So what exactly did you conclude after reading that article, in relation to Intel using TIM on HEDT chips?
If i may ask, the liquid metal compound, which people put directly on the die after delidding to decrease the temps, thats different than indium solder, right?
Yes.
If a company server room gets a little warmer than it used to, but the work gets done a lot faster, they will not complain about the new servers, AMD or Intel.
Unless the chip fails, or the computer crashes, from the heat, which isn't going to happen, then they will not know anything about it one way or the other, AMD or Intel.
If i may ask, the liquid metal compound, which people put directly on the die after delidding to decrease the temps, thats different than indium solder, right?
Are you kidding? Think about your statement.
The polymer TIM Intel uses might not have the best thermal conductivity, but it will outlast most other TIMs aside from indium solder. Anything an enthusiast puts in there usually needs to be redone periodically.Thanks. Why doesnt Intel use at least that instead of regular non-conductive TIM, if they are not going to solder? Price, i guess?
Which one, the room getting 2 degrees warmer or the chip failing?
Seriously, have you *ever* heard of solder to the heat spreader failing? After over 40 years in this industry, and many thousands of CPU's, that's one failure I've never seen or even heard about. Clearly there is a problem with their current solution. It just plain doesn't work well enough, if parts are overheating in stock configuration. Bad thermal solution, plus pushing the clocks too much as *stock* has made a huge mess. It really can't be denied.The polymer TIM Intel uses might not have the best thermal conductivity, but it will outlast most other TIMs aside from indium solder. Anything an enthusiast puts in there usually needs to be redone periodically.
I think you might have read my post wrong. I mean that indium is the best and most durable bar none, but that was only tangential to the question asked, if you'd care to re-read that. The Intel polymer TIM is designed for long life, it resists drying out and won't pump out like many aftermarket products, but as we all know, it's a compromise.Seriously, have you *ever* heard of solder to the heat spreader failing? After over 40 years in this industry, and many thousands of CPU's, that's one failure I've never seen or even heard about. Clearly there is a problem with their current solution. It just plain doesn't work well enough, if parts are overheating in stock configuration. Bad thermal solution, plus pushing the clocks too much as *stock* has made a huge mess. It really can't be denied.
Coffee Lake-U / Cannon Lake-U Geekbench 3 Score
https://browser.primatelabs.com/geekbench3/8393354
The very first 14nm++ CFL-U results, quite a bit early for a product launching in 2018. Apparently there's a dual-core SKU as well, not only quad-cores - though both should pack GT3e graphics (Iris Plus 740/750). Base clock is up by 800 MHz (32%) compared to Core i7-7660U (assuming it's 15W).
Edit: BIOS suggests it could be Cannon Lake-U (Intel Corporation CNLSFWR1.R00.X086.D00.1705141926). If that's the case, 3.3 GHz is a nice bump from Core i7-7600U (2.8 GHz) as well, not bad for their first 10 nm implementation.
I actually don't think the room will get any warmer, but I knew someone would chime in about that.The one where you implied (if not outright stated) that server room admins care nothing about power usage and heat output.
Coffee Lake-U / Cannon Lake-U Geekbench 3 Score
Room getting warmer is an issue but not a realistic issue. The cascade failure when there is an interruption of cooling that this will fall victim to earlier is a real issue.Which one, the room getting 2 degrees warmer or the chip failing?
The wider public overall has no idea what their CPU temperature is and they could not care less.
They also know nothing about the insides of their computers. They can see the Intel or AMD sticker on the case.
If a company server room gets a little warmer than it used to, but the work gets done a lot faster, they will not complain about the new servers, AMD or Intel.
Unless the chip fails, or the computer crashes, from the heat, which isn't going to happen, then they will not know anything about it one way or the other, AMD or Intel.
Minor clarification since so many people forget that power dissipation is not constant: it is also dependent on the amount of time at each power state.The server room won't get any warmer regardless of TIM, solder, or heat sink choice - heat load into the room is only dependent on the power dissipation of the chip, not how hot the die is.
Far Cry is pretty wacky:
10C20T: 83.4
10C10T: 105.7
4C8T: 104.4
4C4T: 108.2