These two companies have huge budgets in R&D for fabricating semi-conductors, so I was wondering who uses a more advanced process for fabricating their chips?
As I understand it, Intel was first to the 90nm process, that in itself is quite an accomplishment. In addition, Intel is a leader in packaging, coming up with new and alternative package designs and configurations (FCPGA, organic package, BGA, etc.). IBM seems to have a more advanced materials team though, leveraging SOI.
I never took an advanced VLSI class so I don't know for sure, but I think that the SOI gates have a longer switch time (remembering some slide for extra credit a couple years ago). And the only real advantage to SOI is the ability to produce copper chips.
Anyone here a VLSI EE?
As I understand it, Intel was first to the 90nm process, that in itself is quite an accomplishment. In addition, Intel is a leader in packaging, coming up with new and alternative package designs and configurations (FCPGA, organic package, BGA, etc.). IBM seems to have a more advanced materials team though, leveraging SOI.
I never took an advanced VLSI class so I don't know for sure, but I think that the SOI gates have a longer switch time (remembering some slide for extra credit a couple years ago). And the only real advantage to SOI is the ability to produce copper chips.
Anyone here a VLSI EE?