Uhh, it says right there that the material they use is much more robust than lead-based alternatives. All materials crack under certain pressure.
Haha read right past Figure 18. Was getting confused as hell with all the technobabble that I don't understand.
I wonder which of the factors specified in the article that influence STIM joint reliability are directly related to the decision Intel took with Ivy Bridge.
It seems that if they wanted to, Intel could have made indium solder joints reliable enough with Ivy Bridge by addressing some of the above mentioned factors. Then again this isn't my field of expertise at ALL