Discussion Samsung Exynos SoC thread

[soresu]

I read somewhere that China is doing a lot of research into using free electron lasers for EUV light. It seems to me that might be a technically better/cheaper pathway than how ASML's EUV machines work, only because of how hideously complex and Rube Goldberg those are

A recent paper from Okinawa Institute of Science and Technology showed how that complexity could be drastically reduced with less mirrors, more power and greater efficiency.

 

[soresu]

Even if they reach Samsung's tier, is enough to cause problems to ASML big time.

Canon's "nanoimprint lithography" is also making the rounds as a possible alternative.

Nanoimprint Lithography Aims to Take on EUV

Canon’s new chip-making system competes on cost, energy, and precision

spectrum.ieee.org

 

[NostaSeronx]

Canon's "nanoimprint lithography" is also making the rounds as a possible alternative.

Nanoimprint Lithography Aims to Take on EUV

Canon’s new chip-making system competes on cost, energy, and precision

spectrum.ieee.org

Currently, the NZ2C is best served on more mature nodes. Anything that uses SADP/SAQP larger than 40nm on metal pitches. As the current spec makes it about on-par with Nikon's NSR-S622D on throughput and NSR-S635E on everything else. Where it starts to replace current-gen EUV LELE and High-NA EUV is by 2027~2029.

We'll have to see how fast the Canon Tochigi (Spring 2025) can deliver NIL tools, to Tata/PSMC Dholera (End of 2026). As well if AIST/Canon can get the 12.5 half-pitch&L/S(Metal pitch: 25nm 3D-NIL Dual Damascene) ready for 2nm (plus?) Rapidus.

 

[Doug S]

A recent paper from Okinawa Institute of Science and Technology showed how that complexity could be drastically reduced with less mirrors, more power and greater efficiency.

You did notice the NA vs scan field limitation of that design. It also requires a "compact EUV source". Who's going to build that?

Its all well and good to say "wow why so many mirrors" but ASML didn't design it that way because they like mirrors.

 

[DZero]

Still, Japanese tends to make excellent inventions when the situation requires. Seems that they are starting to wake up after a big slumber. About time.

 

[DZero]

Aaand... Exynos 2500 only ended on the Z Flip 7... RIP Samsung Exynos.

Exynos 2500 specs show up online months before its debut alongside Galaxy Z Flip 7

A reliable tipster has revealed what Samsung's upcoming Exynos 2500 has in store. It will feature a 10-core CPU, a 16 CU AMD RDNA 3 iGPU and LPDDR5x-9600 RAM. Rumours say it will debut alongside the Galaxy Z Flip 7 in August.

www.notebookcheck.net

 

[moinmoin]

For the record, as of the end of Q3 2024 their order backlog sits at €36 billion. (And let's see how much that changed since at the Q4 2024 earnings call on January 29th.)

And that seems to be unchanged:

"ASML had an order backlog of approximately 36 billion euros at the end of 2024, CFO Roger Dassen said in a transcript of a video interview."
https://www.cnbc.com/2025/01/29/asml-earnings-report-q4-2024.html

 

[DZero]

And this is it... Exynos 2500 only on Z Flips.

Samsung bets on Exynos 2500 to power the Z Flip 7, but will the Z Fold 7 be spared?

During Samsung's earnings report, the company confirmed Exynos 2500 is coming for some models in the second half of the year. The question is: which ones?

www.phonearena.com

And maybe the S25 FE will pull it too.

Samsung lost a lot of terrain.

 

[DZero]

Samsung Galaxy S25 FE May Use Dimensity 9400 Chip Due to Exynos 2400e Issues - Gizmochina

Samsung is preparing to launch the Galaxy S25 FE, expected in late 2025. While the company initially planned to equip the device with its in-house Exynos 2400e chipset, a new report from Notebookcheck suggests that production issues may lead to the adoption of MediaTek’s Dimensity 9400 as an...

www.gizmochina.com

And this is it... RIP Exynos 2500.

 

[LightningZ71]

I am beginning to think that Samsung's days, for whatever they are currently worth, as a "leading edge" logic foundry are done. They need to accept that they are second tier like GloFo and plan accordingly.

 

[DrMrLordX]

I am beginning to think that Samsung's days, for whatever they are currently worth, as a "leading edge" logic foundry are done. They need to accept that they are second tier like GloFo and plan accordingly.

Maybe they need to start collaborating with others to keep up (to a greater degree than they already do).

 

[DZero]

Maybe they need to start collaborating with others to keep up (to a greater degree than they already do).

They were collaborating with Meizu, but seems that since US wanted to restrict CHina, affected SK very hard.

 

[LightningZ71]

I don't necessarily think that it has a lot to do with the US and their actions with respect to China. Samsung hasn't had a quality, high yield node that can be produced in volume, since their 8nm to 5nm generation transition. Everything since then has either missed on yield, or missed on the power/thermal side of the triangle. That's years of struggle.

 

[DrMrLordX]

They were collaborating with Meizu, but seems that since US wanted to restrict CHina, affected SK very hard.

That's small potatoes. Samsung needs to join forces with Intel. And possibly others (GF, IBM, ???).