Vega x2 is a thing.
And AMD's infinity Fabric is their future.
I am a keen observer of the industry, and given Dr Su's & Raj's comments over the latest months, AMD trajectory isn't hard to place. For Gamers and end-users, AMD is going to take the crown.
Lets face it, AMD now has better support and drivers than NVidia. They have a unified architecture (hsa) that AMD has aggressively been working towards for 7 years and that research and development and effort is now coming together and starting to pay off (APU).
But it is not hard to figure that AMD's "Infinity Fabric" plays a big role in all of this. And so does their partnerships with Hynix, thus HBM2 and the new "unified cache controller". AMD development into HSA has given them an ahead start on things like Vega X2 (ie: $799 TitanXp.?), which allows them to showcase their fabric with an array of multi-gpu chips.
Not important? Ask yourself this... if baby vega is nearly equal to GTX1080, then how much wattage would two 1080's be in SLI. Then what would two 1080 in SLI gpu scaling be..? Cost for end-user to buy two 1080's..?
Then realize, that two baby vegas sitting on fabric don't suffers from any of those^ problems. It gives AMD tremendous value. And that is something their competitors typically have never offered.
Infinity fabric is going to be about as big a win as Hypertransport was with the Athlon64 for AMD. I bridge mesh that works as low a level as connecting two Core or GCU modules together, but also as comm link that go through die on the same package, to other modules on different socket, even communicating through other connection types. On top of that it can also be used for GPU to CPU communication, which when you add HBCC to the equation magic happens and that is without having HBM in there yet.
Also to the other doubting scalability. Keep in mind that AMD isn't approaching it like Intel would, at least not now. Right now AMD has 4 different configurations available on their CPU's. In a little while they with have at least a 12c, 16c, 24c, 32c, configurations added to that. That is 8 configurations. Maybe a 2c4t R3, if but let's say 9. That is all Zepplins as far as we can tell. Maybe we scratch the R3 because considering the H2 release at the same time as Raven Ridge I think there is a chance that they are all single CCX devices. This is at least 8 CPU combinations from $100 to probably $3k that will be using a single die. This scalability allows for both macro and micro scalability. They can change the configuration from 2 to 1 CCX, They can can up or decrease the GCU, they can add something like HBM, all easier than before.
But since IF isn't restricted to on die communication the options on what to do with a single die become immense. Think of Little Vega. Maybe little Vega's job isn't really to compete with the 1070. Maybe it's job is to be small enough that they could clock them down and go with 4GB or 2GB of HBM2 and have 4 of them all working efficiently on a single compute card. Losing out to the 1070 won't matter as much if it can double up the density of the chips in an HPC setting.