Not really, they got a better node in the end.
It certainly got them deeper into the red faster than ANY other process available on Earth at that time.
There seems to be a lack of acknowledgement around here that building the best processor in the world doesn't matter at all if you go bankrupt doing it. Now our friends at Intel used the most expensive tech on Earth and STILL didn't produce the best processor in the world.
The other point being missed is that process density improvements are becoming less and less while packaging improvements are a much bigger deal.
Many here still believe that it only makes sense to use one huge monolithic die because (after all) that is the best way to maximize performance.
Pat G seemed to have this same blind spot. It kinda still feels like Intel in general still does as well.
Should AMD produce an N3P Zen 6 that clobbers Nova Lake and Panther Lake as well as maintaining the lead in DC (on N2), I doubt that Intel will survive in its current form.
FWIW, this is exactly what I expect will happen.
On a positive note, I saw Intel released some new packaging design. Better late than never. This is where AMD was back with Zen 2. Still, Zen 3 was such a huge success because AMD overcame the issues with splitting the die up with good design and improvements in packaging. Same thing for X3D.
None of these great advances from AMD had much to do with lithography shrinks IMO. It's a good thing too because lithography shrinks aren't amounting to crap these days. Spend 20 BILLION dollars and get 15% more density. Pretty sad ROI.