It is quite possible TSMC was going to do it on their own (make the investments) in order to attract more customers.
But in the meantime the AI boom started, and most of TSMC capital, facilities were re-purposed to make more of CoWoS packaging.
As of now, it seems like AMD is ramping up the V-Cache at a steady pace. V-Cahce will play a greater role, with more and higher volume products having V-Cache options - Medusa Point, Medusa Halo, in addition to desktop and server.
It is possible that by the time Zen 7 comes around, AMD makes the decision to drop L3 from the main CCD die in premium chiplet products, or even from experimental Zen 6 die.