think the point you are missing is that it is only the chiplet based CPUs that will be N2. In other words, premium products: Server, premium desktop, premium notebook.
For premium products the small cost difference matters less top tier performance.
For lower tier products in consumer sparce, AMD will likely have monolithic designs, and those could be N3P
I think that AMD will continue to use chiplet design for desktop and server. It is possible that like Strix Point, there will be a monolithic die for that specific market (utilizing both P and E cores).
There is reportedly only a 15% transistor density gain from N3E to N2. I suspect that from N3P to N2 it may well be even less.
It is my belief that if AMD believes they can make a processor that is competitive with Intel on N3P, they will certainly do it. Zen 5 desktop could have been produced on N3E (obviously as it WAS used on Turin D). I see no business reason for AMD to pay for N2 if they can best Intel with N3P.
The core count for highest core CPU would go from 192 to 256, which is +33%. But 2 things will happen:
- Memory speeds will go up, including introduction of MrDIMM by the time Venice launches
- L3 per core doubles, with 32 cores being in the same pool (which helps the hit rate further).
Turin utilized a single IOD that connected 12 CCD's (each having 16 cores) for 192 cores. That IOD also connected 12 memory channels of DDR6000.
Assuming that Venice supports 16 channels of MR-DIMM 6400, the bandwidth would go from 576 to 1024Gb/sec. Not quite double, so those speculating that AMD will double the cores per CCD on Venice Dense get a point for their side.
With your contention that the L3 will double, the die size goes crazy though. Cache doesn't scale well in density. It is almost certain that Zen 6 will increase in transistor count from Zen 5. Moving from a 16 core CCD to a 32 core CCD (for dense) would likely more than double the current 86mm2 die ... so lets say 180-200mm2. That is a shockingly huge die on a shockingly expensive process.
You are estimating a 256 core Venice D. If the current rumor is correct that each IOD will handle 4 CCD's, then a 4 IOD processor would have 16 core CCD's and 16 memory channels.
That actually sounds about right to me (unlike the 32 core speculation).
ore counts double per CCD, not per CPU package. Number of CCDs goes down from 12 (Turin Dense) to 8 (Venice Dense) - if my understanding is correct.
See above. I think if the rumors of the 4 channel memory, 4 CCD modular IOD for Venice is correct, then we will be looking at a 256c Venice D using 16 core CCD's.
The non-D Venice would then likely use the 12 core CCD (might even share the one from the desktop) giving it a total of 4 IOD's and 192c of full Zen 6 processors.
If you scale all this down to the SP8 socket that supports 12 DDR5 channels, and assume that the same modular IOD will be used, you get a 3 IOD design. This gives you a 144c non-D Venice and a 192c Venice D.
I can't believe how long we will have to be speculating on this before we find out which of our assumptions were correct .