Joe NYC

Latest activity Postings Featured content About Trophies

• • J

    Joe NYC replied to the thread Question Zen 6 Speculation Thread.

    It's not like they would be wasting a lot of space between the area of the wafer and area of the sum of the tiles. What will, then...

    Today at 10:57 PM
  • J

    Joe NYC replied to the thread Question Zen 6 Speculation Thread.

    I think it was just an existing design in search of customer, and AMD just calls it "semicustom" when a customer finally signed up.

    Today at 9:56 PM
  • J

    Joe NYC replied to the thread Question Zen 6 Speculation Thread.

    Combined size of the chipet AMD is dealing with is not overwhelmingly large, within 400 mm2, so still a good number can fit on 300mm...

    Today at 9:55 PM
  • J

    Joe NYC reacted to burninatortech4's post in the thread Question Zen 6 Speculation Thread with Like.

    That seems very plausible.

    Today at 8:05 PM
  • J

    Joe NYC replied to the thread Question Zen 6 Speculation Thread.

    N32 sold for $400 - $500. That's as mainstream as you get, while N33 is low end. Just because N32 sold far less than it's potential...

    Today at 8:04 PM
  • J

    Joe NYC replied to the thread Question Zen 6 Speculation Thread.

    AMD has been pioneering in this area, and, until now, did not have a very effective and affordable 2.5D solution. Now, AMD has it in...

    Today at 7:56 PM
  • J

    Joe NYC replied to the thread Question Zen 6 Speculation Thread.

    AMD already tried with RDNA 3, with expectation of much bigger volume that was achieved. So the capacity was there back in 2022. The...

    Today at 7:11 PM
  • J

    Joe NYC replied to the thread Question Zen 6 Speculation Thread.

    The question is if (and to what effect) semi-custom evolves in the age of chiplets. Really, it has been pretty much NADA from AMD on...

    Today at 6:57 PM
  • J

    Joe NYC reacted to Saylick's post in the thread Question Zen 6 Speculation Thread with Like.

    It’s called semicustom for a reason. Sony and MS will use off the shelf AMD IP (read: logic blocks) to build their custom APUs. It’s not...

    Today at 6:52 PM
  • J

    Joe NYC replied to the thread Question Zen 6 Speculation Thread.

    Companies other than TSMC (such as ASE) can do the this type of packaging (Integrated Fan Out) just fine. I am not buying that this...

    Today at 6:51 PM
  • J

    Joe NYC replied to the thread Question Zen 6 Speculation Thread.

    BTW, here is Olrak's post that he calls schizopost. Year and a half later, it does not look insane...

    Today at 5:09 PM
  • J

    Joe NYC reacted to marees's post in the thread Question Zen 6 Speculation Thread with Like.

    Ok. I thought you were referring to PC Handhelds Lisa Su let out a statement today on this

    Today at 4:54 PM
  • J

    Joe NYC replied to the thread Question Zen 6 Speculation Thread.

    The discussion was about next gen consoles, which are much bigger die sizes that APUs. Which is why I think it is possible they may go...

    Today at 4:38 PM
  • J

    Joe NYC replied to the thread Question Zen 6 Speculation Thread.

    AMD has used monolithic for mobile, to keep the costs down, but is already expected to go with chiplets with high end mobile. So there...

    Today at 4:10 PM
  • J

    Joe NYC replied to the thread Question Zen 6 Speculation Thread.

    It seems that Intel has mostly the wrong type of packaging for mass market.

    Today at 2:37 PM

  Show older items
• Loading…
• Loading…
• Loading…
• Loading…