Recent content by soresu

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    Question Zen 6 Speculation Thread

    Yes, but that does not detract from the fact that chiplets offer greater versatility within those discrete SKU groups than just one whacking huge core/cache die with bad yields determining core count binning. You still get the option of die binning with chiplets, but on top of chiplet scaling...
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    Question Zen 6 Speculation Thread

    Well yes and no. Yes in theory, but no in the case of ARM where the synthesizable IP probably has the greater part of the IP interoperability prebaked in as long as you are using just their IP, combined with the fact that ARM works with TSMC and Samsung to synergize on process. (the uncore...
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    Question Zen 6 Speculation Thread

    I specifically mentioned a versatile SKU stack based multiples of a small die chiplet, which describes Epyc perfectly.
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    Question Zen 6 Speculation Thread

    What on earth gave you the impression I was talking about smartphone SoCs? 😵‍💫 I was actually talking about Epyc specifically.
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    Discussion Leading Edge Foundry Node advances (TSMC, Samsung Foundry, Intel) - [2020 - 2025]

    Hmmm, seems the exact shape of the forksheet move is still in question: https://www.imec-int.com/en/articles/outer-wall-forksheet-bridge-nanosheet-and-cfet-device-architectures-logic-technology
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    Question Zen 6 Speculation Thread

    Also design costs. Designing beeeg dies has beeeg costs to go with it - AI/ML design tools may be helping to take some of that load off as it gets more and more complex, but it's still anything but trivial to design a 600mm² die vs a 100-150mm² one. Chiplets allow for a very versatile...
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    Discussion Leading Edge Foundry Node advances (TSMC, Samsung Foundry, Intel) - [2020 - 2025]

    Saw this imec roadmap in a video from Ian Cutrress and noticed something nu in the back-side interconnect thing I'd never seen before: "Local signal lines" Wonder if this is moving from purely power delivery to IO/data as well? Edit: It's not labeled as such, but I think the different icon...
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    Discussion RDNA 5 / UDNA (CDNA Next) speculation

    If you thought ReSTIR was a game changer then wait till you see this thing in action.... https://www.lalber.org/2025/04/markov-chain-path-guiding/ Real time path guiding with single scattering in volumes 😎
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    Question Zen 6 Speculation Thread

    If Switch 1/2 and the post Gamecube consoles show us nothing it's that HW spec isn't really all that it's cracked up to be when it comes to selling consoles. It's the platform UX (controllers + UI + fan noise etc), game library and the brand that determines its ultimate success. Medusa/Strix...
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    Question Zen 6 Speculation Thread

    PCIe 6.0 on AMD (Venice by the sound of it): https://www.techpowerup.com/338125/keysight-enables-amd-to-showcase-electrical-pci-express-compliance-up-to-64-gt-s
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    Discussion RDNA 5 / UDNA (CDNA Next) speculation

    Update on HIP RT/RDNA4 performance, I scoured the GitHub repo and found this: https://github.com/GPUOpen-LibrariesAndSDKs/HIPRT/issues/35#issuecomment-2814200540 Evidently they are likely updating it to the nu HIP 7, with optimisations likely to be included along the way.
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    Discussion RDNA 5 / UDNA (CDNA Next) speculation

    For what reason? Does Steam Deck not sell well enough to justify the VG production and AMD/TSMC are bitter about this? Or is Valve delinquent on paying chip royalties?
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    Discussion RDNA 5 / UDNA (CDNA Next) speculation

    Oh ye RDNA5/UDNA/woteva dGPUs will likely launch pretty close to at least one console. Be interesting to see where Valve lands in terms of what semi custom stuff they have next on their roadmap with AMD.
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    Discussion RDNA 5 / UDNA (CDNA Next) speculation

    Actually that's pretty par for the course. The first PC APU with RDNA2 (Rembrandt IIRC) was announced in Jan 2022, over a year after PS5 and XSX/XSS launched in 2020. Then Steam Deck with Van Gogh/Aerith was announced just a month later in Feb 2022.
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    Question Zen 6 Speculation Thread

    Why? Surface bad blood?
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