- Mar 3, 2017
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Off-Topic but:
Did Earth started to rotate counter-wise🤣
Off-Topic but:
Did Earth started to rotate counter-wise🤣
I guess, “The enemy of my enemy is my friend,” applies here 😆
Running legit W11 pro on Asus CHVF-Z no issues. Actually just put a XTX in it also.TPM requirement for Win11 was also just a sticker?
So your claim was all BS, since you couldn't even link to any previous post clarifying your claim that you said existed. Got it.
Third reminder regarding this without answer ^^^. Your statement is debunked.
Sure that's how that works.MS sets the requirements for TPU whether you like it or not.
Holy heck we are entering the Bizarro world.Off-Topic but:
Did Earth started to rotate counter-wise🤣
It's a niche product.Oh and it won’t ship till in mass till Q2.
Strix? yeah.“This year, my ass.”
Oh they have infinitely bigger problem on their hands.Qualcomm biggest miss would be if they mess up pricing.
Oh they have infinitely bigger problem on their hands.
I mean you've seen their binning spreads posted.
It is NOT.
Bespoke CCD.
Only way that makes sense to me is if it uses some new kind of packaging that's not compatible with any existing dies.That would be crazy if it's using a custom CCD AND an custom IO die. Can't imagine the volume will be high enough to justify that.
I believe that it may be a sign of what Zen 6 and on will do.That would be crazy if it's using a custom CCD AND an custom IO die. Can't imagine the volume will be high enough to justify that.
adroc said that there was supposed to be several different configurations using info-R (?) but all but halo got cut , so the plan was reuse but ended up just being specific to halo.Only way that makes sense to me is if it uses some new kind of packaging that's not compatible with any existing dies.
I am skeptical.
Why not, that's basically what apple did with their M series. Best value add is on their notebooks, which sell in decent, but not huge numbers.That would be crazy if it's using a custom CCD AND an custom IO die. Can't imagine the volume will be high enough to justify that.
That wouldn't surprise me in the least.Qualcomm biggest miss would be if they mess up pricing
Nothing about -halo volume justifies it.Can't imagine the volume will be high enough to justify that.
It's not really new.Only way that makes sense to me is if it uses some new kind of packaging that's not compatible with any existing dies.
Should be a late '25 thing, poverty platforms are on a 3y cadence rn iirc.But will Sonoma also be available in 2025 designs or should be late 25 to 26?
yeaIS Zen 5 confirmed to still max out at 8 cores per CCD or is there a chance of more?
Very and a year after the mainline stuff.I wonder how good it will be and will X3D versions will be released
It bends it in half.Will be interesting to see in gaming how vanilla Zen 5 does compared to Zen 4 7800X3D.
It bends it in half.And how much better will X3D Zen 5 be than Zen 4 X3D?
No one really cares what you want.Cause I really do not want 9950X3D and dual CCD design with the cross latency penalty. If games are really going to start using more than 8 cores, we need them on a single CCD or ring bus.
yea
Very and a year after the mainline stuff.
It bends it in half.
It bends it in half.
No one really cares what you want.
You get what you get.
No one really cares what you want.
You get what you get.
Well yeah, gaming and JITs are two things Zen5 excels at.Should have clarified and already edited my post meant in gaming not other things.
what are those wordsWhich in that case the 8 cores on single CCD of Zen 5 with supposedly superior IPC an other performance uplift (clock speeds IMC for better DDR5 speeds) better be ore than enough for future CPU intensive games and soon to be released ones with RTX 5090 and beyond and the per core performance and IPC uplift is more than enough cause I will stick with single CCD 8 core design.