I can finally make this thread.
Phoenix is indeed RDNA3. My advice to everyone: treat the old APU rumours as being out of date.
Phoenix is indeed RDNA3. My advice to everyone: treat the old APU rumours as being out of date.
looks like it's as efficient as 8600G, but because 4 cores are clock limited, it uses less power, and performs slightly worse.8500G tuning in some impressive performance per watt -
https://www.phoronix.com/review/amd-ryzen-5-8500g
At the end he states - "Coming up ahead I have some follow-up benchmarks underway looking more specifically at the Zen 4 vs. Zen 4C per-core power/performance, cTDP lowering to 45 Watts, and other interesting Linux benchmarks."looks like it's as efficient as 8600G, but because 4 cores are clock limited, it uses less power, and performs slightly worse.
This comment shows how green you are. He is correct that computer manufacturers called memory arrays attached to a channel as a memory bank. Just because its an older term doesn't mean its obsolete. It just means you never heard of itWhat are you calling a "memory bank"? I have never heard anyone refer to two modules as "two memory banks" before.
It's fine for an APU. Gaming on a 1050-level chip will not be hampered by 8MB of L3The cheaper Ryzen 3 8300G that keeps the same IGP would be be interesting to see then.
Oh wait it has only 8MB L3 and the igp is 200mhz lower.
8500G tuning in some impressive performance per watt -
https://www.phoronix.com/review/amd-ryzen-5-8500g
yeahIt's fine for an APU. Gaming on a 1050-level chip will not be hampered by 8MB of L3
It is not so easy to just solder things as people may expect, YES, it is cheaper and simplier than putting a slot and then adding a memory to it, in fact this is a lot cheaper and simplier.
But there are hidding costs. First off you need to decide how many boards to produce of each configuration AND DO NOT GET IT WRONG, if you get this wrong you lose a lot of money. And when you start adding variations the posible combination really start to get out of hand. Lets say, you have 3 possible socs, then you have 8, 16 and 32 gb of ram variations of each one, and finally storage, and you can see why storage is the last thing it gets soldered on, otherwise you would se EMMC used a lot more.
It was decided long ago that soldering the cpu to the boards was acceptable as long as memory and storage were modular, because guessing what class of cpu would sell more was easy.
So you can see why this is generally used for low end products, so they can produce one or two boards and thats it. A tactic used in laptops lately was to solder 4GB-8GB DDR4 and offer one extra slot. Not sure if the same can be done with LPCAMM2.
Also for things like Strix Halo we are talking about 32 and 64GB of LPDDR5X, who is going to solder all of that? it is far too risky.
Vast majority of volume products are mobile, soldered products.A lot of people are missing the point. Soldering means stocking and holding multiple boards with multiple different combinations of CPU/RAM/GPU in inventory.
By making it socketed, you only need 1 boards and then just insert the different parts as needed. You don’t need to stock much and instead you can easily make to order. LPCAMM2 memory, can, for example, be installed by a machine at a factory, so if user 1 and user 2 order a 32gb and a 64gb laptop, the laptop construction can happen quickly and without resorting to having tons of inventory.
Inventory is real estate.
Most companies use lean manufacturing and avoid holding inventory wherever possible. Some additional info on this: https://en.m.wikipedia.org/wiki/Lean_manufacturing
Also it does relate to APUs because it is very likely LPCAMM2 is rolling out soon, if it hasn’t already.
A larger or large L3 cache is often very important for gaming with discrete graphics.The cheaper Ryzen 3 8300G that keeps the same IGP would be be interesting to see then.
Oh wait it has only 8MB L3 and the igp is 200mhz lower.
Hard to justify the 8500G at $180 vs the $230 8600G based on those benchmarks, at least if you're doing typical browsing/light gaming with maybe some other non-stressful office work. In a lot of the more GPU limited scenarios the 8500G is closer to the 5600G than to the 8600G.All three CPU-s are cooled with the same AMD stock Wraith stealth CPU cooler.
If this is correct data, in the Cinebench test the R5 5600G heats up to 89 degrees. The R5 8500G and R5 8600G do not go more than 76 degrees in the same test.
iGPU gaming R5 8500G vs R5 5600G. As expected, considering the system memory used+old Vega vs "small RDNA3 iGPU with very high iGPU frequency". DDR5 memory has a significantly higher bandwidth. In short, in this comparison R5 8500G usually offers minimum 10 and sometimes 20 more FPS.
Let's say that slower DDR5 memory 5200 or 5600mhz was used. Again 4CU RDNA2 iGPU at 2.8ghz would be faster vs old Vega 7CU iGPU at 1.9ghz.
R5 5600G, 32gb 3200mhz DDR4
R5 8500G/R5 8600G, 32gb 6000mhz DDR5
Is the 8500G single channel DDR5 only? I've seen conflicting claims on that.
What's the difference between an Arch distro running Steam and another Arch distro running Steam?Interesting... Wonder if it could run SteamOS?
Valve includes optimizations in SteamOS. There are also several technical differences.What's the difference between an Arch distro running Steam and another Arch distro running Steam?
I was all ready to buy a Ryzen 8500G to build a new PC, but found out it doesn't support ECC DRAM after all despite the initial announcement claiming it did. So now I guess I'd have to wait for the 'Pro' version of the 8000G line. Any rumors on when that will arrive?
I would say suck it up and spend the extra 30 bux on the 7600 - which is in stock right now at Newegg for $209.